Product Attribute:
Applicationt:
fiat, Huizhong
Production Description:
Product Name: 4 Layers PCB
1) Layer: 1-4
2) Board finished thickness: 0.4mm to 2.5mm
3) Material: FR-4, CEM-1, Aluminum Based,(KB,SHENGYI)etc.
4) Max. Finished board size: 1040mm by1249mm
5) Min. hole size: 4mil (0.1mm)
6) Min. traces width/space: 0.13mm/0.13*
7) Surface finishing/treatment: HASL/Lead free HASL, Immersion Gold, Gold plating, Immersion silver, immersion Tin, OSP.
8) Copper thickness: 0.5oz to 4oz.
9) Solder mask color: Green/Yellow/ Red /Black/White/ Blue.
10) Copper thickness in hole: >18µm
11) Inner packing: Vacuum packing
12) Outline tolerance: ±0.10mm
Hole size tolerance: PTH±0.05mm NPTH:±0.05mm.
13) Quality ensure: RoHS
14) Special requirements: Buried and Blind vias, impedance control, via plug, BGA soldering, gold finger.
15) Profiling: Punching, Routing, V-cut, Beveling.1) Layer: 1-4
2) Board finished thickness: 0.4mm to 2.5mm
3) Material: FR-4, CEM-1, Aluminum Based,(KB,SHENGYI)etc.
4) Max. Finished board size: 1040mm by1249mm
5) Min. hole size: 4mil (0.1mm)
6) Min. traces width/space: 0.13mm/0.13*
7) Surface finishing/treatment: HASL/Lead free HASL, Immersion Gold, Gold plating, Immersion silver, immersion Tin, OSP.
8) Copper thickness: 0.5oz to 4oz.
9) Solder mask color: Green/Yellow/ Red /Black/White/ Blue.
10) Copper thickness in hole: >18µm
11) Inner packing: Vacuum packing
12) Outline tolerance: ±0.10mm
Hole size tolerance: PTH±0.05mm NPTH:±0.05mm.
13) Quality ensure: RoHS
14) Special requirements: Buried and Blind vias, impedance control, via plug, BGA soldering, gold finger.
15) Profiling: Punching, Routing, V-cut, Beveling.