Pcb Board

Product Attribute:

Applicationt: 

Acura

Production Description:

1, double layer glass epoxy copper clad laminate integrated pcb 2, ShengYi FR4 material
3, immersion gold 4, green solder mask
5, white silk 6, Board thinkness 1.6mm   Quotation time: 1. For PCB & FPC: quotation within 1 hours if all information are clear   2. For PCBA:   quotation within 2 days if all information are clear       One-stop Service: 1. PCB Copy   2. PCB drawing / design  according to your schematic diagram   3. PCB manufacturing   4. Component sourcing   5. PCB Assembly   6. PCBA test       Delivery Time:    

Layers	Sample	First Order	Repeat Order
Single side	3 days	7 days	6 days
Double side	4 days	8 days	7 days
4 Layer	7 days	9 days	8 days
6 Layer	8 days	10 days	9 days
8 Layer	10 days	12 days	10 days
10 Layer	12 days	14 days	12 days
Alu-base	3 days	8 days	7 days
FPC 1 layer	5 days	8  days	8  days

      Shipping Method:       1. By DHL, UPS, FedEx, TNT using clients account   2. We suggest you using our DHL, UPS, FedEx, TNT forwarder   3. By EMS (Usually for Russia Clients), price is high   4. By sea for mass quantity according to customer' s requirement         PCB Production Capability:  

Files	Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.	1 -  12 Layers
Board thickness	0.0075" (0.2mm)-0.125" (3.2mm)
Board Thickness Tolerance	± 10%
Copper thickness	0.5OZ - 4OZ
Impedance Control	± 10%
Warpage	0.075%-1.5%
Peelable	0.012" (0.3mm)-0.02 (0.5mm)
Min Trace Width (a)	0.004" (0.1mm)
Min Space Width (b)	0.004" (0.1mm)
Min Annular Ring	0.004" (0.1mm)
SMD Pitch (a)	0.012" (0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027" (0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005" (0.125mm)
Soldermask Clearance (b)	0.005" (0.125mm)
Min SMT Pad spacing (c)	0.004" (0.1mm)
Solder Mask Thickness	0.0007" (0.018mm)
Hole size	0.008" (0.20mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)	± 0.003" (± 0.0762mm)
Aspect Ratio	10:01
Hole Registration	0.003" (0.075mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au: 1-3u' '
OSP	0.2-0.5um
Panel Outline Tol (+/-)	± 0.004' ' (± 0.1mm)
Beveling	30° 45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS  ISO9001 TS16949  SGS   UL
Special requirements	Buried& blind vias, Impedance control, via plug, BGA soldering and gold finger

We looking forward to the opportunity to work with you.