4 Layers High Density Ups Circuit Board In Shenzhen

Product Attribute:

Voltage:12v

Copper Thickness:0.025-0.075mm

Board Thickness:0.4--2mm

Min. Hole Size:0.2mm

Min. Line Width:0.1mm

Min. Line Spacing:0.1mm

Surface Finishing:HASL

Standard:IPC-A-610G

Tolerance of Etching:1mil(25um)

Solder mask color:Green

Twist&Wrap:0.5%

Certificate:ROSH. ISO9001SGS UL Certificate

Inner packing:Vacuum packingPlastic bag

Outer packing:Standard carton packing

Layer:4

Specialty:Blind and buried via

Applicationt: 

all electronic cars accessary

Production Description:

Welcome To Semshine

-  4 layers high density ups circuit board in Shenzhen

-  immersion gold Surface finishing

-  Made of FR-4

-  Contract Manufacturing  

-  PCB Design & Assembly  

-  Provide Prototyping 

-  SMT&PCBA one-stop source

-  Quick-turn produce