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Company Info
Raymo Electronics Technology Ltd.

Street Address: Shasan Industrial Area

City: Shenzhen

Province: Guangdong

Country/Region: China

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Replacment Lemo Connectors S-Series

Replacment Lemo Connectors S-Series

Application:  DAEWOO

OEM No/Model:  RM-FFA-00S-250-CLAC**Z

Market Type:  After Market

Packing:  Box

Samples:  Charge

Maximum Prodcution Capacity:  5000pcs Per Week

Delivery Time:  3days For Sample

Place of origin:  SHENZHEN

Export Ratio:  71% - 80%

Price Terms:  FOB

Delivery Port:  Shenzhen

Other Price Terms:  CIF

Minimum Order:  5Piece/Pieces

Product Attribute:

Color:Black

Applicationt: 

DAEWOO

Production Description:

Lemo Series S metal circular connectors are designed to be compatible with Lemo connector with a half-moon latching system. 00/0S/1S, 2-6pins, i.e. FFA.1S.304. lemo connector, metal connector, push pull connectors.

 

Details:

1. Shell size 00 to size 1

2. Security of the push-pull self-latching system

3. Multi-pole types 2 to 6 contacts

4. Solder ,print or crimp contacts (straight or elbow)

5. High packing density for space saving

6. Many kinds of  key options to avoid cross mating of similar connectors

7. 360 angle screening for full EMC shielding.

8. polarization by stepped insert (half-moon ) fitted with male and female contacts.

9. Compatible with Lemo® Series S/FFA.

00 series: FFA.00.250  FFA.00.113

0S series: FFA.0S.302  FFA.0S.303  FFA.0S.304

1S series: FFA.1S.302  FFA.0S.303  FFA.1S.304  FFA.1S.305  FFA.1S.306

 

As well:   FGG,FAG,FHG,FFA, PHG,EGG,EGA,ECG,ECA,EPG,EXG, EGG, EPG, EEG, ERA, EXP, EPL,

K series, S series, F series, SC series, ODU connectors, Fischer connector, Hirose connectors, 

Binder connectors and redel connectors.

 

Application:

RAYMOs high quality connectors are found in a variety of challenging applications and environments.

 including:Automotive, Audiovideo, Aviation, Communications, Industrial Control, Information Systems, 

and Machines, Medical, Military, Test and Measurement, Data Acquisition, Data Transfer Equipment.

 Module Power, Sensor, Sensor Systems Instrumentation, Analysis Application.

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