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Company Info
Raymo Electronics Technology Ltd.

Street Address: Shasan Industrial Area

City: Shenzhen

Province: Guangdong

Country/Region: China

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Replacment Lemo Connectors K-Series

Replacment Lemo Connectors K-Series

Application:  DAEWOO, Dongfeng

OEM No/Model:  RM-FGG-0K-3**-CLAC**Z

Market Type:  After Market

Packing:  Box

Samples:  Charge

Maximum Prodcution Capacity:  5000pcs Per Week

Delivery Time:  Sample For3 Working Days, Mp For 5-10 Working Days

Place of origin:  SHENZHEN

Export Ratio:  71% - 80%

Price Terms:  FOB

Delivery Port:  Shenzhen

Other Price Terms:  CIF

Minimum Order:  5Piece/Pieces

Product Attribute:

Color:Black

colour:black or silver or white

Applicationt: 

DAEWOO, Dongfeng

Production Description:

 

Brief instructions:

Series K metal circular connectors are designed to be compatible with Lemo connector with a self-latching system and waterproof.0K/1K/2K, ie: FGG.1K.304.CLAD42Z.

Detail:

1. Shell size 0 to size 3

2. Security of the push-pull self-latching system;

3. Multi-PINs types 2 to 14 contacts;

4. Solder ,PCB type or crimp contacts ;

5. High packing density for space saving;

6. Many kinds of  key options to avoid cross mating of similar connectors;

7. 360 angle screening for full EMC shielding.

8. Watertight connection(IP66-68)

9. Rugged housing for extreme working conditions.

10. Compatible with Lemo® Series K

 0K series: FGG.0K.302.  FGG.0K.303.  FGG.0K.304.  FGG.0K.305.  FGG.0K.306. FGG.0K.307. FGG.0K.308. FGG.0K.309

1K series: FGG.1K.302.  FGG.1K.303.  FGG.1K.304.  FGG.1K.305.  FGG.1K.306. FGG.1K.307. FGG.1K.308. FGG.1K.310  FGG.1K.314 

2K series: FGG.2K.302.  FGG.2K.303.  FGG.2K.304.  FGG.2K.305.  FGG.2K.306. FGG.2K.307. FGG.2K.308. FGG.2K.310  FGG.2K.314  FGG.2K.319

 

As well:   FGG,FAG,FHG,FFA, PHG,EGG,EGA,ECG,ECA,EPG,EXG, EGG, EPG, EEG, ERA, EXP, EPL,K series, S series, F series, SC series, ODU connectors, Fischer connector, Hirose connectors, Binder connectors and redel connectors.

 

Application:

RAYMO:  high quality connectors are found in a variety of challenging applications and environments including: Automotive, Audio-video, Aviation, Communications, Industrial Control, Information Systems, and Machines, Medical, Military, Test and Measurement, Data Acquisition, Data Transfer Equipment. Module Power, Sensor, Sensor Systems Instrumentation, Analysis Application


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