Product Attribute:
Applicationt:
Acura, Alfa romeo, Aston martin, audi, Aux, Baolong, Beiqi, Bentley, BMW, Bugatti, Buick, BYD, cadillac, Changan, Changfeng, Chery, chevolet, Chrysler, Citroen, Changhe Auto, Dadi, DAEWOO, Daihatsu, Dodge, Dongfeng, DADI Auto, Ferrari, fiat, Ford, Foton, Fuqi, Geely, GMC, Gonow, Great wall, Hafei, HAMA, Honda, Hongqi, Huandai, Huizhong, Hummer, Hyundai, Huanghai Auto, Infiniti, iveco, Jaguar, Jeep, Jinbei, JMC, JAC, Kia, Lamborghini, Land rover, Landwind, Lexus, Lincoln, Lotus, LIFAN, Maserati, Maybach, Mazda, Mercedes Benz, MG, Mini, Misubishi, Mitsubishi, Monaro, Nissan, OPEL, Pagani, Peugeot, Porsche, Polarsun Automobile, Renault, Rolls Royce, Rowe, SAAB, Shuanghuan, Shuguang, Skoda, Smart, Soueast, Spyker, ssangyong, SUBARU, Suzuki, Shanghai Maple, Tianma, Toyota, Toyota, volkswagen, volvo, VW, Wanfeng, Wuling, Xiali, Ycaco, Zhonghua, Zhongxing, Zotye
Production Description:
High Energy Ignition Circuit ICs
Description
LD3334 (analog MC3334) is designed to use the signal from a reluctor type ignition pickup to produce a well controlled output from a power Darlington output transistor.
Features
Very Low Peripheral Component Count
No Critical System Resistors
Wide Supply Voltage Operating Range (4.0 V to 24 V)
Overvoltage Shutdown (30 V)
Dwell Automatically Adjusts to Produce Optimum Stored
Energy without Waste
Externally Adjustable Peak Current
Available in Chip and Flip–Chip Form
Transient Protected Inputs
General Layout Notes
The major concern in the substrate design should be to reduce ground resistance problems. The first area of concern is the metallization resistance in the power ground to module ground and the output to the Rdrive resistor. This resistance directly adds to the VCE(sat) of the IC power device and if not minimized could cause failure in load dump. The second concern is to reference the sense ground as close to the ground end of the sense resistor as possible in order to further remove the sensitivity of ignition coil current to ground I.R. drops.
All versions were designed to provide the same pin-out order viewed from the top (component side) of the board or substrate. This was done to eliminate conductor cross-overs. The standard LD3334 plastic device is numbered in the industry convention, counter-clockwise viewed from the top, or bonding pad side.