Product Attribute:
Applicationt:
All kinds of FPC(Flexiable Print Boards)
Production Description:
CWVC-5S for Flex PCBa Separated by UV Laser Depanel,FPC Cutter Equipments Features:
· Pre-camera vision product position registration and model check;
· Coherent Avia NX UV laser with HurrySCAN head;
· High capacity BOFA dust collector;
· User friendly Window based software;
· PCB flexible product jig adjustable for different board size;
· High resolution and accurate Z stage with auto-focus function;
· Large area low friction front loading platform for sliding multiple product jigs;
· Fully covered class 1 safety enclosure;
· Able to do cutting and marking together;
· Compact size;
. Neat and smooth edge, no burr or overflow;
. More quick and easy, shorten the delivery time;
. High quality ,no distortion,surface clean& uniformity;
. Gathering the CNC tech,laser tech,software techHigh accuracy,High speed.
Routing Pcb with Laser FPC depaneling machine,CWVC-5S Detailed Product Description:
Product Name: |
Laser Pcb Separator |
Super: |
Low Power Consumption. |
|
Laser: |
12/15/17W |
Laser Brand: |
Optowave |
|
Power: |
220V 380v |
Warranty: |
1 Year |
Sample for FPC Laser Cutting Machine,Laser PCB Separator-Pcba Depanelizer
Cut PCB with Laser Pcb Depanel Machine,PCB & FPC Depaneling Equipment,CWVC-5S Specification:
Laser |
Q-Switched diode-pumped all solid-state UV laser |
|
Laser Wavelength |
355nm |
|
Laser Power |
10W/12W/15W/17W@30KHz |
|
Positioning Precision of Worktable of Linear Motor |
±2μm |
|
Repetition Precision of Worktable of Linear Motor |
±1μm |
|
Effective Working Field |
460mmX460mm(Customizable) |
|
Laser Scanning Speed |
2500mm/s (max) |
|
Galvanometer Working Field Per One Process |
40mm40mm |
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws· Damages and fractures to substrates and circuits due to mechanical stress
· Damages to PCB due to accumulated debris
· Constant need for new bits, custom dies, and blades
· Lack of versatility each new application requires ordering of custom tools, blades, and dies
· Not good for high precision, multi-dimensional or complicated cuts
· Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
Advantages of Laser PCB depaneling/singulation
· No mechanical stress on substrates or circuits
· No tooling cost or consumables.
· Versatility ability to change applications by simply changing settings
· Fiducial Recognition more precise and clean cut
· Optical Recognition before PCB depaneling/singulation process begins.
· Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
· Extraordinary cut quality holding tolerances as small as < 50 microns.
· No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards
Working principle :
humidity sensor ( humidity and temperature signal ) Microcomputer ( CPU Central Processing Unit ) Heaters ( PTC heating module polymer material heating ) Smart shape memory alloy ( alloy shape with temperature change ) Balance spring ( general balance spring with alloy )
Cutting Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
Tag : PCB Separator,FPC/Pcba Depaneling,PCB Depaneling,PCB Depanelizer