Product Attribute:
Typical Clients:
Electronic Industry
Production Description:
Solder Ball Attachment Using Laser Soldering,Tin-ball Laser Bonding System,CWLS-B Product Description:
Laser tin-ball soldering ball is laser through fiber transmission, the output port is attached to the top of tin-ball, to provide the inlet for high-pressure gas entrance in the annular cavity, to molten solder ball, then high pressure inert gas can ensure there is enough pressure to molten solder ball dripping, guarantee the tin ball will not be oxidation, high precision, good welding effect.
Multi-axis intelligent working platform, equipped with coaxial CCD positioning and monitoring system, effectively ensures soldering accuracy and yield rate.
Solder Ball Attachment Using Laser Soldering,Tin-ball Laser Bonding System,CWLS-B Product Features:
1.apply to solder with high-precision for -10um or +10um, the smallest interval of the product is 100umProduct Features
2.Optional to a bigger range of the solder ball, the diameter is 0.25mm
3.apply to the metal surface with tin, gold and silver. More than 99% soldered product is good.
Solder Ball Attachment Using Laser Soldering Technical Advantages
1.quickly done the process of heating and melting within 0.2s
2.melting the solder ball in the soldering place without splash
3.No flux is required, no pollution, long life time of electronics
4.The smallest diameter of the solder ball is 0.1mm, the machine meets the developing trend of integration and precision.
5. According to different size of the solder ball, the operator can solder different soldering points.
6.The quality of the soldered product is good
7. meet the need of massive production in assembly line with the cooperation of CCD positioning system
Solder Ball Attachment Using Laser Soldering Application
Applied tin-balls spraying soldering, very high soldering accuracy, can effectively ensures the soldering precision especially for the areas sensitive temperature
microelectronics : aviation, military electronics industry, sensor industry
other industries : optical electronic industry, MEMS, sensor industry, BGA, HDD