Other Parts direct from China (Mainland) manufacturer Shenzhen Xinweite Silicone Material Co., Ltd

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Shenzhen Xinweite Silicone Material Co. , Ltd
Street Address: 2/ F 194#guangshen Rd. Xixiang Baoan District, Shenzhen, Guangdong, China City: Shenzhen Province: Guangdong Country/Region: China
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Shenzhen Xinweite Silicone Material Co. , Ltd

Street Address: 2/ F 194#guangshen Rd. Xixiang Baoan District, Shenzhen, Guangdong, China

City: Shenzhen

Province: Guangdong

Country/Region: China

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Led Thermal Conductive Adhesive Tapes

1.UL,ISO9001,SGS certificate 2.Fast delivery time, low price, high quality 3.Ten years in tape Specification: Backing: Glaa cloth, without substrate Liner: PE film Short-term temperature resistant: 150 Long-term temperature ...

Market Type: After Market
Appliaction: Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.

High Thermal Conductivity White Thermal Silicone Grease With ROSH Test Report

Description Excellent thermal conductivity depends on the heat transfer media between devices and a good interface. Silicone has low surface tension to wet most of the surface to reduce thermal contact resistance between the substrate and ...

Market Type: After Market
Appliaction: It can be widely used in the heat transfer medium of electronic components, such as the CPU chip, power blocks, transistor, thyristor and diode ...

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Company Profile

Products

Other parts (3)

Other Parts (2)

Car Care Product (1)

Contact Us

Other Parts

Select to

Led Thermal Conductive Adhesive Tapes

Market Type: After MarketAppliaction: Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.

High Thermal Conductivity White Thermal Silicone Grease With ROSH Test Report

Market Type: After MarketAppliaction: It can be widely used in the heat transfer medium of electronic components, such as the CPU chip, power blocks, transistor, thyristor and diode ...

Select to

Market Type: After Market
Appliaction: Applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling device bonding.

Market Type: After Market
Appliaction: It can be widely used in the heat transfer medium of electronic components, such as the CPU chip, power blocks, transistor, thyristor and diode ...