EMMC/EMCP Reballing Stencil Kit 4 In 1 BGA ReBalling Stencils EMCP162 EMCP186 EMMC153 EMMC169

Product Attribute:

Type:Car Polish

G.W:1.5kg

Expiration Date:2022years

Carton size:4cm

Content:3ml

Applicationt: 

4 in 1 BGA ReBalling Stencils for eMMC153 ( eMMC169 )

Production Description:

4 in 1 BGA ReBalling Stencils for eMMC153 / eMMC169 / eMCP162 / eMCP186,  eMMC/eMCP Reballin Template Stencil for BGA Rework Station, 4 in 1 bga reballing kit and eMMC / eMCP plant Stencil.

 eMMC/eMCP Reballing Stencil kit 4 in 1 BGA ReBalling Stencils

    4 in 1 design bga reballing kit, capable apply to eMMC153/eMMC169, eMCP162 /eMCP186 nand flash IC reballing    at the same time
    Moldcore designs with dismountable, easy to change through two screws, change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing
    Moldcore uses high accuracy IC Grinding Machine, accurate IC location