Product Attribute:
Color:Silver
Type:SCART
Application:PCB
Gender:Male
Multi-pole:3 pins
Shell size:00B
Terminal type:Solder type
Male and Female contacts:Brass with gold-plated
Applicationt:
Acura, Bugatti, Changan, Dadi, DADI Auto
Production Description:
Brief introduction
Series B metal circular connectors in many size and outer diameter for different applications are designed to be compatible with Lemo® connector Series B which with a self-latching system for easy operations.
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Product details |
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1.Shell size |
00 to size 3(#00,#0,#1,#2,#3) |
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2. Multi-pole types |
2 to 32 contacts |
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3. Security |
push-pull self-latching system |
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4.contacts (straight or elbow) |
Solder ,print or crimp |
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5.Packing |
High packing density for space saving |
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7.Key options |
0°,30°,45°,60° |
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8. Male contacts and female contacts |
brass with gold-plated surface |
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9. Out shells |
brass with chrome nickel-plated surface |
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10. Insulator |
PPS and PEEK |
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11.Screening |
360 angle screening for full EMC shielding. |
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12. Compatible with Lemo® Series B, including FGG,FAG,FHG,EGG,EGA,ECG,ECA,PHG,EPG,EXG.such as: |
FGG.0B.303.CLAD42z FGG.0B.304.CLAD52z FGG.0B.305.CLAD42 |
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FAG.0B.302 FAG.0B.303 FAG.0B.304 FAG.0B.305 FAG.0B.306 FAG.0B.307 |
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FHG.0B.302 FHG.0B.303 FHG.0B.304 FHG.0B.305 FHG.0B.306 FHG.0B.307 |
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EGG.0B.302 EGG.0B.303 EGG.0B.304 EGG.0B.305 EGA.0B.302 EGA.0B.303 |
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ECG.0B.302 ECG.0B.303 ECG.0B.304 ECG.0B.305 |
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ECA.0B.302 ECA.0B.303 ECA.0B.304 ECA.0B.305 |
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PHG.0B.302 PHG.0B.303 PHG.0B.304 PHG.0B.305 PHG.0B.306 PHG.0B.307 |
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EPG.0B.302 EPG.0B.303 EPG.0B.304 EPG.0B.305 EPG.0B.306 EPG.0B.307 |
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EXG.0B.302 EXG.0B.303 EXG.0B.304 EXG.0B.305 EXG.0B.306 EXG.0B.307 |
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FGG, FAG, FHG, PHG, EGG, EGA, ECG, ECA, EPG, EXG, B/K/S/F/P series, ODU, Fischer, Hirose, binder and redel connectorsis available. |
Application:
RAYMO's high quality connectors are found in a variety of challenging applications and environments including:Automotive, Audio-video, Aviation, Communications, Industrial Control, Information Systems, and Machines, Medical, Military, Test and Measurement, Data Acquisition, Data Transfer Equipment. Module Power, Sensor, Sensor Systems Instrumentation, Analysis Application.