Tile Blade

Product Attribute:

Applicationt: 

Tile Blade

Production Description:

Wafer segment diamond blade is perfect for hard material ,such as Granite, Porcelain etc
Application: Porcelain ,Granite , Hard material
Material: Diamond/ stone concrete. 
steel(TCT hole saw) (bush hammer)
diamond grain and resin(HTC grinding pad with PCD)
Alloy SteelTCT saw blade
 
       Type: Diamond blade etc.  
Hole Saw(TCT Hole Saw).
            Twist Drill Bit (SDS hammer drill bit and chisel)
Abrasive pad (HTC grinding pad with PCD)
Abrasive disc(bush hammer)
Saw blade(TCT saw blade)