1, double layer glass epoxy copper clad laminate integrated pcb 2, ShengYi FR4 material 3, immersion gold 4, green solder mask 5, white silk 6, Board thinkness 1.6mm Quotation time: 1. For PCB & FPC: quotation within 1 hours if all information are clear 2. For PCBA: quotation within 2 days if all information are clear One-stop Service: 1. PCB Copy 2. PCB drawing / design according to your schematic diagram 3. PCB manufacturing 4. Component sourcing 5. PCB Assembly 6. PCBA test Delivery Time: Layers Sample First Order Repeat Order Single side 3 days 7 days 6 days Double side 4 days 8 days 7 days 4 Layer 7 days 9 days 8 days 6 Layer 8 days 10 days 9 days 8 Layer 10 days 12 days 10 days 10 Layer 12 days 14 days 12 days Alu-base 3 days 8 days 7 days FPC 1 layer 5 days 8 days 8 days Shipping Method: 1. By DHL, UPS, FedEx, TNT using clients account 2. We suggest you using our DHL, UPS, FedEx, TNT forwarder 3. By EMS (Usually for Russia Clients), price is high 4. By sea for mass quantity according to customer s requirement PCB Production Capability: Files Gerber, Protel, Powerpcb, Autocad, Orcad, etc Material FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) Layer No. 1 - 12 Layers Board thickness 0.0075" (0.2mm)-0.125" (3.2mm) Board Thickness Tolerance ± 10% Copper thickness 0.5OZ - 4OZ Impedance Control ± 10% Warpage 0.075%-1.5% Peelable 0.012" (0.3mm)-0.02 (0.5mm) Min Trace Width (a) 0.004" (0.1mm) Min Space Width (b) 0.004" (0.1mm) Min Annular Ring 0.004" (0.1mm) SMD Pitch (a) 0.012" (0.3mm) pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) 0.027" (0.675mm) Regesiter torlerance 0.05mm Min Solder Mask Dam (a) 0.005" (0.125mm) Soldermask Clearance (b) 0.005" (0.125mm) Min SMT Pad spacing (c) 0.004" (0.1mm) Solder Mask Thickness 0.0007" (0.018mm) Hole size 0.008" (0.20mm)-- 0.257" (6.5mm) Hole Size Tol (+/-) ± 0.003" (± 0.0762mm) Aspect Ratio 10:01 Hole Registration 0.003" (0.075mm) HASL 2.5um Lead free HASL 2.5um Immersion Gold Nickel 3-7um Au: 1-3u OSP 0.2-0.5um Panel Outline Tol (+/-) ± 0.004 (± 0.1mm) Beveling 30° 45° V-cut 15° 30° 45° 60° Surface finish HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, Certificate ROHS ISO9001 TS16949 SGS UL Special requirements Buried& blind vias, Impedance control, via plug, BGA soldering and gold finger We looking forward to the opportunity to work with you.
- Application :
- Acura