Product Attribute:
Applicationt:
This standard is applicable to the manufacture of military power microelectronic device as heat sink sealing material with three two aluminum oxide ceramic sealing material and structure of molybdenum and copper alloy bar, also applies to the manufacture of civil power in microelectronic devices, high thermal conductivity constant expansion sealing heat sink with molybdenum and copper alloy bar.
Production Description:
Molybdenum copper powder after moulding, at 1300-1500 °liquid phase sintering. The method for preparing the material uniformity is not good, there are more closed voids, density is usually less than 98%, but by adding a small amount of nickel activated sintering, mechanical alloying method or for the reduction of preparation of ultrafine oxide, nanometer powder can improve the sintering activity, thereby improving the copper tungsten, molybdenum and copper alloy density. But the nickel activation sintering can make material conductive, thermal conductivity decreases significantly, mechanical alloying, introducing an impurity will also reduce the material conductivity; oxide is prepared by reduction of powder, process complexity, low production efficiency, it is difficult to mass production. Tungsten, molybdenum skeleton infiltration method: first in the tungsten or molybdenum powder press molding, and sintered into a certain porosity, molybdenum tungsten skeleton, and then the molten copper infiltration. This method is suitable for low copper content in copper tungsten, molybdenum and copper products. Copper tungsten and molybdenum copper compared, has less weight