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Company Info
ChangWei Electronic Equipment Manufactory

Street Address: Building 2, Gang Hua Xing Industrial Park, Chongqing Road, Fuyong Town, Shenzhen, China

City: Shenzhen

Province: Guangdong

Country/Region: China

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PCB Separators,FPC Flexible PCB Laser Cutting Machine,CWVC-5S

PCB Separators,FPC Flexible PCB Laser Cutting Machine,CWVC-5S

Application:  All type of PCB and FPC

Market Type:  After Market

Packing:  Plywood Case

Samples:  Free

Maximum Prodcution Capacity:  30 Set/Month

Delivery Time:  15-30 Days After Payment

Place of origin:  China

Export Ratio:  81% - 90%

Price Terms:  FOB

Delivery Port:  Shenzhen

Minimum Order:  1Set/Sets

Product Attribute:

Applicationt: 

All type of PCB and FPC

Production Description:

PCB Depanelers,PCB Depaneling Equipment,PCB Separators,FPC Flexible PCB Laser Cutting Machine,CWVC-5S Working principle :
humidity sensor ( humidity and temperature signal ) Microcomputer ( CPU Central Processing Unit ) Heaters  ( PTC heating module polymer material heating ) Smart shape memory alloy ( alloy shape with temperature change ) Balance spring ( general balance spring with alloy )
 

FPC Flexible PCB Laser Cutting Machine,CWVC-5 Description:
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.
PCB Depaneling Equipment-Pcb Fpc Depanelizer Specification:

Laser class 1
Max. working area (X x Y x Z) 300 mm x 300 mm x 11 mm
Max. recognition area (X x Y) 300 mm x 300 mm
Max. material size (X x Y) 350 mm x 350 mm
Data input formats Gerber, X-Gerber, DXF, HPGL,
Max. structuring speed Depends on application
Positioning accuracy ± 25 μm (1 Mil)
Diameter of focused laser beam 20 μm (0.8 Mil)
Laser wavelength 355 nm
System dimensions (W x H x D) 1000mm*940mm
*1520 mm
Weight ~ 450 kg (990 lbs)

Power supply
230 VAC, 50-60 Hz, 3 kVA
Cooling Air-cooled (internal water-air cooling)
Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity < 60 % (non-condensing)
Required accessoires Exhaust unit

 Advantages:
1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.
2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;
3.Reduce energy consumption, Cost savings.
Cost-effective, fast cutting speed, stable performance
Principle of PCB laser cutting machine:

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