The service life of the connector is the primary indicator of the reliability of the connector performance. As the requirements for fault-free performance of electronic products continue to increase, the service life of the china connector design becomes a design orientation.

Stress release data is an effective tool for designers to predict the life of electronic connectors and make decisions based on existing data on the choice of contact material. These data are now widely used in the computer, communications and automotive electronics industries. At present, the data on the life cycle of the product is very scarce, especially in the computer field. Not only that, it also shortens the product development cycle and the validity of a more useful data.

Most china connector designers use stress release data primarily to reduce the range of contact material options based on application requirements. However, many designers are also looking for appropriate test methods to more accurately predict the characteristics of the connector life. This can greatly reduce the number of samples required for testing and the associated costs associated with testing a large number of samples.

At present, most of the automotive china connector in the harsh environment and in the hood are designed with 3 or 1 design requirements; and the operating temperature of the next generation of automotive connectors is expected to increase. Except that most non-automotive connectors do not seem to need to maintain their stability under the above conditions. However, high-density connectors require a lower initial insertion force, which in turn reduces stress release. This makes the stress release even important at lower temperatures.

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