The Bergquist Thermal Clad.pdf

In general, copper foil is etched to form printed circuit with each component interconnected. With the same line width and thickness, IMS boards can carry much more current. Normally, the thickness of copper foil from 1~4OZ (35μm~140μm) are available.  Heat conduction & dielectric layer The technology of Thermal Clad resides in the dielectric layer. The dielectric is a proprietary polymer/ceramic blend that gives Thermal Clad its excellent electrical isolation properties, low thermal impedance and also withstands mechanical and thermal stress. The polymer is chosen for its electrical isolation properties, ability to resist thermal aging and high bond strengths. The ceramic filler enhances thermal conductivity and maintains high dielectric strength.