MTCS2601 silicon sensing die in SMD ceramic package
The MTCS2601 sensors consist of a micro-machined thermal conductivity sensor using four Ni-Pt resistors realized using MEMS technologies. The sensor is mounted in a miniature SMD package, available on tape and real. This MEMS TC sensor, combined with simple low power CMOS standard integrated circuits, is an excellent choice for size-critical leakage OEM detector or miniature vacuum gauge based on Pirani principle requiring ultra-low power consumption, long lifetime and no maintenance. Applications are primary pressure control in rough environment with power and size constraints, or detection in closed volume of gas leakage or moisture, or intrusion.
MTCS2601 Thermal Conductivity Sensor Applications
MTCS2601 Thermal Conductivity Sensor Features
MTCS2601 Thermal Conductivity Sensor Electrical specification
Description | Symbol | Min | Typical | Max | Unit |
Measuring resistance at 23°C ± 2°C | Rm1 and Rm2 | 110 | 120 | 135 | |
Reference resistance at 23°C± 2°C | Rt1 and Rt2 | 240 | 270 | 300 | |
Ratio | Rtx/(Rm1+Rm2) | 1.06 | 1.12 | 1.18 | |
Resistance difference | Rm1-Rm2 | -1.5 | ------ | +1.5 | |
Resistance difference | Rt1-Rt2 | -3.5 | ------ | +3.5 | |
Temperature coefficient (Rm,Rt) 20°C-100°C | 0.0050 | 0.0055 | 0.0060 | /°C | |
Geometry factor | G | 3.9 | mm | ||
Thermal loss coefficient | 0.101 | mW/°C |
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