Quick Details

• Place of Origin:

  China

• Export Ratio:

  81% - 90%

• OE Experience:

  No

Product Name:Thinning Or Back Grinding Wheel

Thinning Or Back Grinding Wheel

Application

all car

Product Description:

Thinning or back grinding wheel         
Silicon Wafer Back-side Diamond Grinding Wheel
BackGrindingWheelsfor GaN Wafer
Silicon wafer back grinding wheels
back grinding Wheel for inserts
 
Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.
Coolant: Oil, emulsion
workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt
Material of workpiece: monocrystalline silicon and some other semiconductor materials.
Specifications
1.be used with Japanese, German, American, Korea and Chinese grinders 
2.superior grinding performance 
3.high cost performance
 

Shape code	Profile Sketch	Conventional Specification (mm)
		Out diameter D	Thickness T	Hole diameter H
6A2		175	30, 35	76
		200	35	76
		375	40	127
6A2T		195	22.5, 25	170
		280	30	228.6
		350	35	235
6A2T-		209	22.5	158

 
Application: back thinning, grinding and fine grinding.
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials. 
Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

Henan More Super Hard Products Co., Ltd is one of the leading company expert in supplying various ultra hard products including synthetic diamond tools, Cubic Boron Nitride(CBN) tools, which is widely used in Petroleum & Geology Industry, Auto & Aviation Processing Industry, Electric ...[Read More]

Company Profile:

• Main Product:

  Cbd

• Business Type:

  Trading Company

• Current Export Market:

  North America