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TM-WCA Series α-Alumina For Monocrystalline Silicon

    • Application: polishing calcined alumin...
    • Market Type:After Market 
    • FOB Price: Inquiry For It?
    • Other Price Term: FOB/CNF/CIF
    • Payment Terms: T/T, CASH
    • Samples: Free

Quick Details

  • Place of Origin:

    China

  • Samples:

    Free

  • Delivery Time:

    15 Working Days

  • Packing:

    Plastic Bags

  • Delivery Port:

    Shanghai/Tianjin/Qingdao/Lianyungang

  • Export Ratio:

    21% - 30%

  • OE Experience:

    No

Product Name:TM-WCA Series α-Alumina For Monocrystalline Silicon

TM-WCA Series α-Alumina For Monocrystalline Silicon

Application

polishing calcined alumina

Product Description:

This abrasive material is developed by our company specially for the electronics industry. It uses commercial alumina as main raw material and adopts special mineralizing agent. After high temperature calcination, it will turn into tabular alumina with grain crystal of a certain thickness-to-diameter ratio. Tabular alumina is ground and strictly classified. The powder color is white. According to the users requirements, we can produce this abrasive material with Chinese standard or Japanese JIS standard.  
Features:
Crystal has a plate form and peripheral edge is smooth, which makes it free from scratch. It has characters of narrow particle size distribution, high hardness (Mohs hardness 9) and strong grinding force. After being ground, the plate has good-quality surface. It can reach the quality level of similar foreign products and replace the imported ones. It is produced exclusively by our company in China. 
Applications:
1)     Electronics industry: Monocrystalline silicon wafer polishing
2)     Electronics industry: crystalline lens polishing
3)     Electronics industry: Aluminum alloy material, like mobile phone shell and stainless steel polishing
4)     Decoration industry: stainless steel tableware and other decorating material polishing
5)     Spraying material: plasma spraying
Models:
WCA03WCA05WCA09WCA12WCA15WCA20, etc.
Main Technical Parameters of TM-WCA Series-Alumina for Monocrystalline Silicon Wafer Abrasive:


      Index
 
Type
AL2O3
(%)
Impurity Content (%) True Density
(g/cm³)
L.O.I. PH Value Suspension Property Grinding Rate
(μm/min)
SiO2 Fe2O3 Na2O
TM-WCA 99.6 0.05 0.05 0.25 3.92 0.04 7.5-8.5 24hr 7.5
Imported Abrasive 99.6 0.08 0.05 0.30 3.92 0.10 7.5-8.5 24hr 7.5

Note:
1)    Suspension performance is holding time without settlement after two abrasive materials (our companys WCA and Japanese Rich Jimmy PWA15) are mixed with suspending liquid in equal proportion.
2)    Grinding rate is measured by grinding 4-inch monocrystalline silicon wafer on the same grinding machine with these two abrasive materials (our companys WCA and Japanese Rich Jimmy PWA15). 

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Supplier Details

Zhengzhou Tianma Micropowder Co. , Ltd.

Market Type: After Market 
Business Type: Manufacturer
Main Product: Alumina, Aluminum Oxide, A-alumina, Alpha-alumina, Aluminum Hydroxide, Al2o3

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