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CPU Thermally Conductive Pad

    • Application: 1 .Laptop 2. Communicatio...
    • Market Type:After Market 
    • Price: Inquiry For It?

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Product Name:CPU Thermally Conductive Pad

CPU Thermally Conductive Pad

Application

1 .Laptop 2. Communication hardware equipment 3. High-speed hard disk drive equipment 4. Automobile engine control mould 5. Micro processor, memory chip and graphics processor 6 Mobile equipment

Product Description:

  1. it is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

     Features & benefits:

    1.High compressibility, soft and flexible, designed for applications in low-stress application environment

    2. Nice thermal conductivity

    3. Electrical insulation

    4. Meet with the environmental requirements of ROHS and UL

    5. Natural stickiness

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Supplier Details

Shenzhen Xinweite Silicone Material Co. , Ltd

Market Type: After Market 
Business Type: Manufacturer
Main Product: Silicone Material

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