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High Temperature Hot Melt Adhesive 1107

    • Application: all type
    • Market Type:After Market 
    • FOB Price: Inquiry For It?
    • Payment Terms: L/C, T/T
    • Samples: Free
    • Minimum Order: 300KG

Quick Details

  • Place of Origin:

    China

  • Samples:

    Free

  • Delivery Time:

    10 Days

  • Packing:

    25KG/CTN

  • Delivery Port:

    Zhongshan

  • Export Ratio:

    61% - 70%

  • OE Experience:

    No

Product Name:High Temperature Hot Melt Adhesive 1107

High Temperature Hot Melt Adhesive 1107

Application

all type

Product Description:

Application:

1107 hot melt glue stick is thermoplastic resin which could be used for the bonding of electronic components such as basilar panel, capacitances, coil and copper, steal and aluminum .It could also be used for bonding ABS,PVC,PET and the similar plastic material.

Feature:
1.According with UL94-V0 and REACH standard.
2.Smokeless and Non-pungent odor.Fast curing and easy to operate

Specification:


ITEM
DATA Testing Method
Appearance White Stick Visual
Diametermm) 11.2+0.5 Sliding Callipers
Soften Point() 140±10 Ring and Ball Method
Tensile strength(Mpa) 60  ASTM D412-98A
Hardness 80 Shore(A/ 30)
Drying time(second) 8-10 JISK-6730
Viscosity(160   CP) 16000±1500 Brookfied LVF
Viscosity(170  CP) 12000±1500 Brookfied LVF
Viscosity(180   CP) 9000±1500 Brookfied LVF

Packing:
25KG/CTN

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Supplier Details

Zhongshan Conor Electronic Technology Co. , Ltd

Market Type: After Market 
Business Type: Manufacturer
Main Product: Adhesive and Sealant
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