Application:
1107 hot melt glue stick is thermoplastic resin which could be used for the bonding of electronic components such as basilar panel, capacitances, coil and copper, steal and aluminum .It could also be used for bonding ABS,PVC,PET and the similar plastic material.
Feature:
1.According with UL94-V0 and REACH standard.
2.Smokeless and Non-pungent odor.Fast curing and easy to operate
Specification:
ITEM |
DATA | Testing Method |
Appearance | White Stick | Visual |
Diametermm) | 11.2+0.5 | Sliding Callipers |
Soften Point() | 140±10 | Ring and Ball Method |
Tensile strength(Mpa) | 60 | ASTM D412-98A |
Hardness | 80 | Shore(A/ 30) |
Drying time(second) | 8-10 | JISK-6730 |
Viscosity(160 CP) | 16000±1500 | Brookfied LVF |
Viscosity(170 CP) | 12000±1500 | Brookfied LVF |
Viscosity(180 CP) | 9000±1500 | Brookfied LVF |
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