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Depanelizer-China Flex Pcb Separator Machine With UV Laser,CWVC-5S

    • Typical Clients: Electronic Industry
    • OEM No/Model: CWVC-5S
    • Market Type:OE Market 
    • FOB Price: USD 1
    • Payment Terms: L/C, T/T
    • Minimum Order: 1Set/Sets

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Product Name:Depanelizer-China Flex Pcb Separator Machine With UV Laser,CWVC-5S

Depanelizer-China Flex Pcb Separator Machine With UV Laser,CWVC-5S

Product Description:

OEM No/Model: CWVC-5S

Depanelizer-China Flex Pcb Separator Machine with UV Laser,CWVC-5S Detailed Product Description:


Product Name:
Laser Pcb Separator Super: Low Power Consumption.
Laser: 12/15/17W Laser Brand: Optowave
Power: 220V 380v Warranty: 1 Year
Cutting Pcb with Laser Printed Circuit Board Separator Machine,CWVC-5S Specification:

Laser
Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength 355nm
Laser Power 10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor ±2μm
Repetition Precision of Worktable of Linear Motor ±1μm
Effective Working Field 460mmX460mm(Customizable)
Laser Scanning Speed 2500mm/s (max)
Galvanometer Working Field Per One Process 40mm40mm
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws· Damages and fractures to substrates and circuits due to mechanical stress
· Damages to PCB due to accumulated debris
· Constant need for new bits, custom dies, and blades
· Lack of versatility each new application requires ordering of custom tools, blades, and dies
· Not good for high precision, multi-dimensional or complicated cuts
· Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
Advantages of Laser PCB depaneling/singulation
· No mechanical stress on substrates or circuits
· No tooling cost or consumables.
· Versatility ability to change applications by simply changing settings
· Fiducial Recognition more precise and clean cut
· Optical Recognition before PCB depaneling/singulation process begins.
· Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
· Extraordinary cut quality holding tolerances as small as < 50 microns.
· No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards

Working principle :
humidity sensor ( humidity and temperature signal ) Microcomputer ( CPU Central Processing Unit ) Heaters  ( PTC heating module polymer material heating ) Smart shape memory alloy ( alloy shape with temperature change ) Balance spring ( general balance spring with alloy )


Cutting ApplicationFPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting;

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Supplier Details

ChangWei Electronic Equipment Manufactory

Market Type: OE Market 
Business Type: Manufacturer
Main Product: Pcb separator,Pcb Cutting Machine,Pcb Router machine,Pcb Fpc Soldering and other SMT Equipment
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