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| Base Material | FR4/CEM/Aluminum/Non-halogen |
| Layer Count | 1-10 layer |
| Thickness of Board | 0.2-3.0mm |
| Thickness of Base Copper | 17um-105um |
| Finishing | HAL(LF)/Immersion gold/Plating gold/Gold finger/OSP |
| Profile | Routing/Punching |
| Min. hole | 0.2mm ( 8 mil ) |
| Min.line width | 0.1mm ( 4 mil ) |
| Min.line spacing | 0.1mm ( 4 mil ) |
| Solder mask color | Green/Blue/Red/Black/Matt Green/Yellow/White |
| Silkscreen color | White/Black/Red/Yellow |
| Certification |
UL-796 Certified (E334023) ISO 9001: 2008 / ISO14001:2004 |
| Leadtime | sample:Double-layer:1-3 days; Multi-layer:2-5 days |
| mass:Double-layer:3-7 days; Multi-layer:7-9 days | |
| Special requirment | half-hole;buried and blind vias;peelable;control impedence;etc. |
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