Technical description:
Material: FR-4
Layer: 6
Thickness of board: 1.0MM
Surface finish: Immersion gold + OSP
Min. hole size: 0.1mm(4mil)
Min.line 75mm3mil)
Min.line space: 0.1mm(4mil)
Special technique: Blind & buried Vias+Impedance control
lamination:1-2,3-4, 5-6
Use:Mobile phone
Hitech Circuits Co.,Limited is a PCB manufacturer from China and we focus on multilayer printed circuit board; High density PCB /HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board,, the ranging from 1L up to 26L. If you have interest in our service and products, please contact us freely.
(Note: China PCB manufacturer Hitech Circuits Co.,Limited specially produces on multilayer printed circuit board / Multilayer PCB; High density PCB / HDI, hard gold board; Flexible board / FPCB; Bergquist Aluminum based board / MPCB, etc.)
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